Assembly house@PTI
Failure analysis@SiP /FOWLP /embedded substrate /16 stack die / Flip chip /Cu wire
EFA @TDR
NDT @3D X-ray
SFA @fail pin mapping
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Day | Followers | Gain | % Gain |
---|---|---|---|
November 03, 2023 | 15 | 0 | 0.0% |
January 28, 2022 | 15 | +1 | +7.2% |